Analog Devices and Tyndall Sign Strategic Research Partnership
Acknowledging Tyndall National Institute as one of Europe’s leading technology research centers, Analog Devices (ADI) has signed a multi-year, multi-million Euro research agreement with Tyndall. This agreement further strengthens the relationship between Tyndall and ADI, spanning two decades of research and development collaboration.
The long-term and strategic partnership between this global semiconductor leader and Ireland’s ICT research center provides continuity of innovative research capability as well as access to the world-class talent at Tyndall.
Photographed at the Announcement, (above from L-R): Peter Smyth, Commercial Director, Tyndall; Denis Doyle, Vice President & General Manager, Analog Devices; Prof. William Scanlon, CEO, Tyndall; and Leo McHugh, VP, Global Industrial Business Unit, Analog Devices.
The news was welcomed by the Minister for Business, Enterprise and Innovation, Heather Humphreys, who said, “We have long recognized the essential role that Tyndall plays in world-leading research and innovation and we welcome its continued growth as a leading global research center for ICT. The recent commitment of an additional funding through Budget 2018 demonstrates the Government's support. This latest announcement from Analog Devices further exemplifies the value of Tyndall’s research and its positioning internationally.”
Speaking at the announcement, Denis Doyle, Vice President & General Manager, Analog Devices said that ADI’s long established Ireland operations have contributed substantially to its global leadership position, stating, “This strategic agreement with Tyndall builds on the long-term relationship between our two organizations and further strengthens our research agenda in Ireland. It will enable us to collaborate on core technologies of mutual interest for communications, energy, agri-tech and advanced manufacturing”.
We are delighted to be working with this global leader on industry-focused research which will have real impact for Analog,” said William Scanlon, CEO, Tyndall.
“The agreement enables Analog to tap into Tyndall’s multiple research centers ‘under one roof’, covering materials, processes, circuits, advanced manufacturing and application engineering to meet Analog’s requirements for the future.”
While the partners have not disclosed specific research themes, the engagement will enable the pooling of knowledge and expertise between academia and industry, including research, intellectual property development and talent acquisition.
