Alpha and Omega Semiconductor Introduces First Molded Chip Scale Package
Alpha and Omega Semiconductor Ltd. (AOS) introduced the AOC2403 – described by the company as the industry’s first Molded Chip Scale Package (MCSP) in a tiny 0.97 x 0.97 x 0.3mm power package. Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. The significant performance improvements of the MCSP technology make it ideal for the latest ultra-portable applications such as smart phones, tablet PCs, UltraBooks and other mobile hand-held devices.
MCSP can easily replace a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. The MCSP encapsulates AOS’s low on-resistance MOSFET silicon in a Green (halogen-free) molding compound, which end result is to give it a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products.
"The Molded Chip Scale Package offers an innovative solution to ultra-slim designs while improving the package robustness compared to existing CSP solutions. The innovative package, along with the low on-resistance AOS MOSFET technology, provides designers of ultra-portable systems with a compelling new power management solution." said Peter Wilson, Director of Low Voltage MOSFETs at AOS.
AOC2403 is a 20V 95mΩ P-Channel MOSFET housed in a halogen-fee MCSP. The package dimensions are 0.97 x 0.97 x 0.3mm. The AOC2403 is the cornerstone on which additional first-class MCSP products are being developed.
The AOC2403 is immediately available in production quantities with a lead-time of 12 weeks. The unit price for 1,000 pieces is $0.35.
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