Allixon Corp. (Toronto, Canada) has entered into discussions with a private company in the field of semiconductor packaging technologies, the developer of a novel device packaging technology, which has developed a family of proprietary products, architected and optimized for RF, system-in-package (SIP), 3D memory stacks, memory devices, MEMS and high power components.
The company's solutions make it possible for companies to meet performance, reliability and size requirements of semiconductors devices used in a wide range of applications, including wireless phones, personal computers, PDAs and other high-end consumer products. Moreover, the products developed by the company are low cost in nature and meet the cost-effectiveness requirement of modern consumer products.
