Allegro Debuts SE, SG and SH Packaging Technology

Allegro MicroSystems Inc. (Worcester, MA) announced the release of its next-generation, hall-effect, sensor packaging technology. The new SE, SG and SH packages consist of a magnet and a hall-effect IC over-molded in a single step, eliminating the presence of air voids that can be problematic during potting or over-molding.

The sensor packages consist of a single over-mold, which holds together a samarium cobalt magnet, a ferrous pole piece and a hall IC that have been optimized to the magnetic circuit. The close proximity of the magnet to the IC along with the high operating temperature materials used in all aspects of construction, allows this technology to provide heatsinking, permitting higher operating temperatures.